Advanced Wirebond Interconnection Technology
by Shankara K. Prasadقیمت نهایی
- تخفیف زماندار−۹٬۰۰۰ تومان
۹٬۰۰۰ تومان صرفهجویی نسبت به قیمت اصلی
نسخه اصلی و اورجینال
بلافاصله پس از خرید، فایل کتاب روی دستگاه شما آمادهٔ دانلود است.
مشخصات کتاب
- نویسنده
- by Shankara K. Prasad
- ناشر
- Springer Nature
- سال انتشار
- ۲۰۰۴
- فرمت
- زبان
- انگلیسی
- حجم فایل
- ۶۷٫۴ مگابایت
- شابک
- 9781280148248، 9781402077623، 9781402077630، 9786610148240، 1280148241، 1402077629، 1402077637، 6610148244
دربارهٔ کتاب
advanced Wire Bond Interconnection Technology Addresses Wire Bonding From Both Manufacturing And Reliability Perspectives. It Analyzes And Explores The Various Factors That One Needs To Consider: Design, Materials, Processing, Equipment, Quality Testing And Reliability Engineering, And Last But Not The Least, Operator Training. This Book Is Intended To Be A Comprehensive Source Of Information And Knowledge That Enables Both A Newcomer To The Field And A Veteran Who Needs Instant Information To Make A Decision On A Process Problem. The Book Explains Not Only How To Do Things Such As: Designing A Bond Pad Or A Lead Finger, How To Select A Right Bond Wire, How To Design A Capillary And How To Optimize A Bonding Process On The Factory Floor; But The Book Also Explains Why To Do It That Way.
a Cd-rom Is Included, Which Contains 2d And 3d Animations Of Many Concepts That Are Discussed In This Book. The Animations With Voice-overs Help The Reader Grasp The Ideas Faster With Visual Experience, Which Leads To Better Retention.
کتابهای مشابه
Advanced Interconnects for ULSI Technology: Baklanov/Advanced Interconnects for ULSI Technology
۴۹٬۰۰۰ تومان
Copper Interconnect Technology
۴۹٬۰۰۰ تومان
Ceramic Interconnect Technology Handbook
۴۹٬۰۰۰ تومان
Linkages: Manufacturing Trends In Electronics Interconnection Technology Manufacturing Trends In Electronics Interconnection Technology
۴۹٬۰۰۰ تومان
Interconnect Noise Optimization in Nanometer Technologies
۴۹٬۰۰۰ تومان
Interconnect Technology and Design for Gigascale Integration
۴۹٬۰۰۰ تومان
Interconnect Noise Optimization in Nanometer Technologies
۴۹٬۰۰۰ تومان
Interconnect Noise Optimization in Nanometer Technologies
۴۹٬۰۰۰ تومان
Interconnect Reliability in Advanced Memory Device Packaging
۴۹٬۰۰۰ تومان
Advanced Nanoscale ULSI Interconnects : Fundamentals and Applications
۴۹٬۰۰۰ تومان
Interconnect Reliability in Advanced Memory Device Packaging
۴۹٬۰۰۰ تومان
3D interconnect architectures for heterogeneous technologies : modeling and optimization
۴۹٬۰۰۰ تومان
قیمت نهایی
۴۰٬۰۰۰ تومان
