میکرو مهندسی سیستم‌های هوافضا

This is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing and materials characterization for developing miniaturized smart instruments for aerospace systems, satellites and satellite subsystems. Front Matter......Page 1 Acknowledgement......Page 6 Preface......Page 3 Table of Contents......Page 0 Table of Contents......Page 7 1.1 Overview......Page 8 1.2 Fabrication Technologies......Page 12 1.3 MEMS Components......Page 23 1.4 Commercial Applications......Page 30 1.5 Trends in MEMS Technology......Page 32 1.6 Journals and Conferences......Page 33 1.7 References......Page 34 2.1 Introduction......Page 36 2.2 Spacecraft Applications......Page 50 2.3 Silicon Satellites......Page 64 2.4 Manufacturing Future Space Systems......Page 67 2.5 Conclusions......Page 71 2.7 References......Page 72 3.1 Introduction......Page 80 3.2 Stress and Strain in MEMS......Page 82 3.3 Constitutive Relations......Page 85 3.4 Piezoelectricity......Page 93 3.5 Failure Theories......Page 94 3.6 Fracture Mechanics......Page 96 3.7 Mechanical Properties of MEMS Structures......Page 100 3.8 Fatigue......Page 107 3.9 Microstructure of MEMS Materials......Page 112 3.10 Other MEMS-Related Subjects......Page 114 3.11 Examples......Page 115 3.12 Future Challenges......Page 119 3.13 References......Page 121 4.2 Material Properties of SiC......Page 125 4.3 Thin Film Growth......Page 126 4.4 Processing Techniques......Page 129 4.5 Micromachining of SiC......Page 131 4.6 SiC-on-Insulator Technologies......Page 137 4.7 SiC Devices and Applications......Page 141 4.9 References......Page 146 5.1 Introduction......Page 151 5.2 Laser Processing......Page 153 5.3 Physical Principles of Laser Processing......Page 157 5.4 Supporting Systems in Laser Processing......Page 166 5.5 Utility and Limitations of Laser Processing......Page 170 5.6 Microengineering Applications......Page 172 5.7 A Case Study: Developing a PLD Materials-Processing Tool......Page 185 5.8 Conclusions and Brief Overview of Trends......Page 200 5.9 References......Page 201 6.1 Introduction......Page 206 6.2 Historical Development of Lithium Batteries......Page 207 6.3 The Li-ion Battery......Page 210 6.4 Plastic Li-ion Batteries......Page 222 6.5 Conclusion......Page 228 6.7 References......Page 229 7.1 Introduction......Page 232 7.2 Simulation Software......Page 233 7.3 Microsystem Fabrication Technologies......Page 238 7.4 Two Microsystem Investigation Examples at LAAS......Page 244 7.5 Reliability......Page 256 7.6 Conclusions......Page 261 7.8 References......Page 262 8.2 Basic Concepts......Page 264 8.3 Engineering Considerations for Packaging......Page 288 8.4 Advanced Approaches......Page 319 8.5 Conclusions......Page 347 8.6 References......Page 348 9.1 Introduction......Page 352 9.2 Principle of Operation......Page 356 9.3 Mechanical Structure......Page 360 9.4 Electrical Interface and Signal Processing......Page 375 9.5 Design Trade-offs......Page 388 9.6 Future of Micromachined Gyroscopes......Page 389 9.7 References......Page 390 10.1 Introduction......Page 393 10.2 MEMS-Based Monitoring System for Space Applications......Page 394 10.3 Macro System-Level Architecture......Page 395 10.4 The Plug-and-Play COTS Approach......Page 412 10.5 Wireless Integrated Network Sensors......Page 415 10.6 Design of a Microinstrumentation Cluster......Page 416 10.7 Fabrication and Testing of the Mu Cluster......Page 437 10.8 Appendixes......Page 444 10.9 References......Page 448 11.1 Introduction......Page 453 11.2 Chemical Microsensor Technologies......Page 463 11.5 References......Page 486 12.2 Fabrication Technology......Page 489 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches......Page 491 12.4 Actuators......Page 494 12.5 Micromirrors for Adaptive Optics......Page 499 12.6 Micromirrors for Beam Steering......Page 503 12.8 Fresnel Lens......Page 509 12.9 Gratings......Page 510 12.10 Microoptical Bench and Automated Assembly of Microsystems......Page 516 12.12 References......Page 519 13.1 Introduction......Page 523 13.2 Future Communication System Design Requirements......Page 525 13.3 Micropackage Fabrication and Testing Method......Page 529 13.4 Micropackaged High-Isolation Interconnects......Page 536 13.5 Conformally Micropackaged LNA......Page 543 13.6 Discrete Micromachined Packages......Page 546 13.7 Micromachined Filters for High-Density Integration......Page 550 13.8 Conclusions......Page 554 13.9 References......Page 555 14.1 Introduction......Page 557 14.2 Shear Stress Imager......Page 561 14.3 Shear Stress Measurements and Fluid/Actuator Interaction......Page 568 14.4 Integration......Page 574 14.5 Control......Page 575 14.6 Electronics......Page 579 14.8 References......Page 582 15.1 Introduction......Page 585 15.2 To Distribute or not to Distribute?......Page 588 15.3 Issues and Problems......Page 609 15.4 Generalized Analysis......Page 625 15.5 Conclusions......Page 636 15.6 References......Page 638 16.3 Calculation of Theoretical Performance......Page 640 16.4 Calculation of Thrust......Page 641 16.5 Propellant Characteristics......Page 643 16.6 Special Propellant Considerations for Microthrusters......Page 644 16.7 Propellants: Cold-Gas Systems_11......Page 645 16.8 Monopropellants......Page 646 16.9 Bipropellants......Page 648 16.10 Solid Propellants......Page 650 16.11 Propellant Delivery and Combustion Concepts......Page 651 16.13 Appendixes......Page 654 16.14 References......Page 657 17.1 Introduction......Page 659 17.2 Micronozzles......Page 665 17.3 Fluid Actuators......Page 670 17.4 Laser-Based Processing of Glass/Ceramic Materials......Page 673 17.5 Microthruster Fabrication......Page 676 17.6 Microthruster Performance......Page 686 17.7 Micropropulsion via Bioenergetic Decay Processes......Page 689 17.10 References......Page 694 C......Page 699 D......Page 700 I......Page 701 M......Page 702 P......Page 705 S......Page 707 T......Page 708 Y......Page 709 Annotation Collects many of the ideas, fundamental principles, and technology rudiments that can profoundly change the manner by which aerospace systems are designed, engineered, and assembled. The concepts presented advance the use of microengineering principles to impart intelligence, volition, and motility to systems on the miniature scale, thereby effecting a change in the paradigm of how aerospace systems should be developed, maintained, and used. The 17 chapters cover the general areas of materials/mechanics/processing and packaging, microsystem devices, distributed system architectures, and satellite subsystems. The book is written in a tutorial style providing worked examples, key equations, and process sequences. Annotation c. Book News, Inc., Portland, OR (booknews.com) Annotation Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples Henry Helvajian, Editor. Includes Bibliographical References And Index.