Signal Integrity Characterization Techniques

Today’s emerging high-speed digital applications require a special kind of design engineer who understands the subtle signal integrity issues at hand. Although a classical electrical and computer engineering education is helpful, it is the high-frequency microwave effects that normally cause the most problems within telecommunications and computer systems, channels, and components. Reflections from impedance discontinuities, crosstalk, intra-line skew, and a multitude of other problems can immediately stop a system from working properly. Clearly, there is a gap in the college electrical engineering courses between the traditional digital and microwave curricula. This is why learning never stops for signal integrity engineers. This book addresses this gap with a focus on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, printed circuit boards (PCBs), cables, integrated circuit (IC) packages, and backplanes are critical elements of differential channels that must be designed using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements. Cogently addressing the future of signal integrity and the effect it will have on the data-transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional, digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real-world applications and providing a wide array of case studies that show how each technology can be used from backplane design challenges to advanced error correction techniques this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.Contents Preface xviiAcknowledgements xxixPart I: Getting Started: Introducing TDR and VNA Techniques and the Power of S-Parameters 3Part II: Backplane Measurements and Analysis 239Part III: Assuring Quality Measurements: Probing and De-Embedding 303Part IV: Jitter and Active Signal Analysis 459Part V: Analysis of New Technologies 549Part VI: Future Technology Trends 651Author Biographies 749 Signal Integrity Characterization Techniques addresses the gap between the traditional digital and microwave measurement technologies while focusing on a practical and intuitive understanding of signal integrity effects within the data channel. High-speed interconnects such as connectors, PCB’s, cables IC packages and backplanes are critical elements of differential channels that must now be optimized using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test and must yield data that correlates with each other. Most of this book concentrates on real-world application of signal integrity measurements...from backplane design challenges to advanced error correction techniques to jitter measurement tools. The authors’ approach wisely address many of today’s high-speed technologies, provides excellent insight into itsfuture direction and will teach the reader valuable lessons pertaining to the signal integrity industry. Blank Page 1 signal-integrity,digital,high-speed