راهنمای آماده‌سازی سطح زیرلایه: مکس رابرتسون

Substrate Surface Preparation serves as a practical, one-stop reference, covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers you detailed guidance in the entire substrate surface preparation process, from lapping and polishing... to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides you with a complete understanding of important maintenance methods and the full range of equipment available in the field. You gain the know-how and confidence you need to produce desired results when processing a sample of new material, rather than wasting time and money on a trial and error approach. Moreover, this authoritative book presents in-depth discussions on key applications, such as optics production and semiconduictor de-lamination and deconstruction. "Substrate Surface Preparation Handbook serves as a practical, one-stop reference, covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers you detailed guidance in the entire substrate surface preparation process, from lapping and polishing ... to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides you with a complete understanding of important maintenance methods and the full range of equipment available in the field. You gain the know-how and confidence you need to produce desired results when processing a sample of new material, rather than wasting time and money on a trial and error approach. Moreover, this authoritative book presents in-depth discussions on key applications, such as optics production and semiconductor de-lamination and deconstruction."-- Unedited summary from book Content: Introduction. Preparation: Before the Start. Lapping. Polishing. Specific Processes and Materials. Specialized Techniques. Surface Finish. Optics. Semiconductor Device Deconstruction. Metallurgical Processing and Microscopy. Setting Up a Laboratory. Using Interferometry. Appendix: The Workshop Grazing Incidence Interferometer. Introduction Preparation : before the start Lapping Polishing Specific processes and materials Specialized techniques Surface finish Optics Semiconductor device Deconstruction Metallurgical Polishing and Microscopy Laboratory Setup Using Interferometry.