The Electronics Assembly Handbook

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. Front Matter....Pages i-xix Front Matter....Pages 1-2 Systems, Vision and Components in Electronics Assembly....Pages 3-6 Managing Automated Electronics Assembly....Pages 6-9 Front Matter....Pages 11-11 PCB Production Equipment....Pages 13-15 Modern Platers and Etchers....Pages 15-20 Chemicals in PCB Manufacturing....Pages 20-25 Cleaning PCBs for Higher Quality....Pages 25-32 Producing Quality Multilayer PCBs....Pages 32-33 Plasma Desmearing....Pages 33-38 Chip-on-board Technology....Pages 41-45 Chip-and-Wire Technology....Pages 45-51 Tab and Flip-Chip Technology....Pages 52-54 Front Matter....Pages 57-57 Component Insertion Equipment....Pages 59-64 Workstations....Pages 64-70 Automatic Component Insertion/Placement Systems....Pages 70-76 Automated Pin Insertion....Pages 76-79 Automated Placement Techniques....Pages 79-81 Assembly Challenges....Pages 85-86 Robots in the Electrical and Electronics Industry....Pages 86-93 Consistency and Quality Using Robots....Pages 93-99 Robot Hand Exchangers....Pages 99-103 Front Matter....Pages 57-57 Vision-Guided Assembly....Pages 103-111 Vibratory Insertion Process: A New Approach to Non-Standard Component Insertion....Pages 115-119 Front Matter....Pages 121-121 SMT Growth....Pages 123-129 Realizing the Benefits of SMT....Pages 129-137 Designing Reliability into Surface-Mount Assemblies....Pages 137-143 Design Solutions....Pages 143-150 Choosing SMT and Setting Up a Facility....Pages 150-156 SMT Advantages....Pages 156-163 Pick-and-Place Machines....Pages 163-169 Surface-Mount Assembly Using Machine Vision....Pages 169-175 SMD Placement Using Machine Vision....Pages 175-179 Hot-Air Leveling....Pages 183-190 Testability Circuit and Board Access Problems....Pages 190-195 Conductive Epoxy for SMT Solder Replacement....Pages 195-201 The Removal and Replacement of SMCs....Pages 201-204 Front Matter....Pages 205-205 New Applications....Pages 207-211 New Materials and Equipment....Pages 211-216 Integral Substrate Package Technology....Pages 216-217 Front Matter....Pages 219-219 Solder/Cleaning, Test and Rework....Pages 221-224 Solder Joint Acceptability....Pages 227-230 Front Matter....Pages 219-219 Solder Coating and Leveling....Pages 285-293 Screen Printing....Pages 293-300 Solvent Flushing....Pages 303-309 Rosin Solder Flux Residues....Pages 309-317 Aqueous Cleaning....Pages 317-323 Cleaning Surface-Mounted Assemblies....Pages 324-329 Wave Solder Defects....Pages 230-236 Desoldering Components....Pages 333-338 Soldering System Trends....Pages 239-245 Wave Soldering: A Study in Process Control....Pages 245-251 Optimizing the Wave Soldering Process....Pages 252-259 Computerized Soldering Systems....Pages 259-263 Re-Examination of Soldering Techniques....Pages 263-272 Adhesives for SMD Wave Soldering....Pages 275-279 Adhesive Evaluation....Pages 280-282 Front Matter....Pages 339-339 Bare-Board testing....Pages 343-346 Automatic Optical Inspection Systems....Pages 346-352 Machine Vision....Pages 352-360 Component Testers and Handlers....Pages 363-371 Handlers....Pages 371-375 Front Matter....Pages 339-339 Inspection Equipment....Pages 393-395 Image Processing and Non-Destructive Testing....Pages 395-401 Lead Scanning....Pages 379-382 Design of SMA for Testability....Pages 405-411 Test and Inspection of Hybrid Microcircuits....Pages 411-416 In-Circuit and Functional ATE....Pages 419-424 Functional Test....Pages 424-430 Probe Design and Test Fixturing....Pages 385-390 Test Program Development and Processing Power....Pages 433-440 Robotic Automated-Test Workcells....Pages 440-447 Front Matter....Pages 449-449 Clean Room Technology....Pages 453-458 Modular Clean Rooms....Pages 458-460 Clean Room Air Monitoring....Pages 463-466 ESD Control....Pages 469-473 Static Shielding Techniques....Pages 474-477 Front Matter....Pages 479-479 Computer Control of Modern Factory Operations....Pages 481-490 Electronics CAE/CAD/CAM....Pages 491-500 CAD/CAM for PCB Manufacturing....Pages 500-504 Designing PCBs for Surface-Mount Assemblies....Pages 504-510 CAD in Hybrid Production....Pages 510-514 Front Matter....Pages 479-479 Discrete Wired Circuit Board Production....Pages 515-522 Front Matter....Pages 523-523 Automating the Assembly of Electronic Products....Pages 525-530 Test, Rework and Inspection Management Costs....Pages 530-533 Flexible Manufacturing....Pages 533-537 Computer Simulation....Pages 537-543 Local Area Networks....Pages 543-548 Materials Handling Accessories....Pages 551-557 Automated PCB Handling....Pages 557-562 Automated Guided Vehicle Systems....Pages 562-568 Batch-of-One Assembly....Pages 571-576 FMS for PCB Assembly....Pages 576-581 PCB Assembly and Test....Pages 581-589 Factory Control And Robotic Systems....Pages 589-599 Erratum....Pages 604-604 Back Matter....Pages 601-603