Adhesives technology for electronic applications : materials, processes, reliability

"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley Content: Preface , Pages vii-viii Acknowledgements , Pages ix-x 1 - Introduction , Pages 1-37 2 - Functions and Theory of Adhesives , Pages 39-94 3 - Chemistry, Formulation, and Properties of Adhesives , Pages 95-168 4 - Adhesive Bonding Processes , Pages 169-260 5 - Applications , Pages 261-346 6 - Reliability , Pages 347-391 7 - Test and Inspection Methods , Pages 393-430 Appendix , Pages 431-439 Index , Pages 441-457 Materials and process engineers Licari and Swanson believe this is the first book on adhesives to stick entirely to and spread comprehensively over the electronics field. They explain the electrical, thermal, and environmental requirements of the electronic devices and circuits for their colleagues and for chemists who are formulating and developing new adhesive compositions. To help electrical design engineers select and specify a reliable adhesive for a specific application, they provide the basic chemistry and properties of adhesives. For manufacturing engineers, they discuss the various cleaning, deposition, curing, and rework processes and equipment. They also examine the potential failure modes and mechanisms and the reliability aspects of adhesives that would interest quality assurance personnel. Annotation :2005 Book News, Inc., Portland, OR (booknews.com) This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. * "I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley Content: Preface, __Pages vii-viii__Acknowledgements, __Pages ix-x__1 - Introduction, __Pages 1-37__2 - Functions and Theory of Adhesives, __Pages 39-94__3 - Chemistry, Formulation, and Properties of Adhesives, __Pages 95-168__4 - Adhesive Bonding Processes, __Pages 169-260__5 - Applications, __Pages 261-346__6 - Reliability, __Pages 347-391__7 - Test and Inspection Methods, __Pages 393-430__Appendix, __Pages 431-439__Index, __Pages 441-457__ Adhesives are extensively used and are vital in the assembly and packaging of electronic devices, especially in the current proliferation and mass production of electronic hardware.