Microengineering Aerospace Systems

This is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing and materials characterization for developing miniaturized smart instruments for aerospace systems, satellites and satellite subsystems. 1884989039......Page 1 Front Matter......Page 2 Acknowledgement......Page 7 Preface......Page 4 Table of Contents......Page 8 1.1 Overview......Page 9 1.2 Fabrication Technologies......Page 13 1.3 MEMS Components......Page 24 1.4 Commercial Applications......Page 31 1.5 Trends in MEMS Technology......Page 33 1.6 Journals and Conferences......Page 34 1.7 References......Page 35 2.1 Introduction......Page 37 2.2 Spacecraft Applications......Page 51 2.3 Silicon Satellites......Page 65 2.4 Manufacturing Future Space Systems......Page 68 2.5 Conclusions......Page 72 2.7 References......Page 73 3.1 Introduction......Page 81 3.2 Stress and Strain in MEMS......Page 83 3.3 Constitutive Relations......Page 86 3.4 Piezoelectricity......Page 94 3.5 Failure Theories......Page 95 3.6 Fracture Mechanics......Page 97 3.7 Mechanical Properties of MEMS Structures......Page 101 3.8 Fatigue......Page 108 3.9 Microstructure of MEMS Materials......Page 113 3.10 Other MEMS-Related Subjects......Page 115 3.11 Examples......Page 116 3.12 Future Challenges......Page 120 3.13 References......Page 122 4.2 Material Properties of SiC......Page 126 4.3 Thin Film Growth......Page 127 4.4 Processing Techniques......Page 130 4.5 Micromachining of SiC......Page 132 4.6 SiC-on-Insulator Technologies......Page 138 4.7 SiC Devices and Applications......Page 142 4.9 References......Page 147 5.1 Introduction......Page 152 5.2 Laser Processing......Page 154 5.3 Physical Principles of Laser Processing......Page 158 5.4 Supporting Systems in Laser Processing......Page 167 5.5 Utility and Limitations of Laser Processing......Page 171 5.6 Microengineering Applications......Page 173 5.7 A Case Study: Developing a PLD Materials-Processing Tool......Page 186 5.8 Conclusions and Brief Overview of Trends......Page 201 5.9 References......Page 202 6.1 Introduction......Page 207 6.2 Historical Development of Lithium Batteries......Page 208 6.3 The Li-ion Battery......Page 211 6.4 Plastic Li-ion Batteries......Page 223 6.5 Conclusion......Page 229 6.7 References......Page 230 7.1 Introduction......Page 233 7.2 Simulation Software......Page 234 7.3 Microsystem Fabrication Technologies......Page 239 7.4 Two Microsystem Investigation Examples at LAAS......Page 245 7.5 Reliability......Page 257 7.6 Conclusions......Page 262 7.8 References......Page 263 8.2 Basic Concepts......Page 265 8.3 Engineering Considerations for Packaging......Page 289 8.4 Advanced Approaches......Page 320 8.5 Conclusions......Page 348 8.6 References......Page 349 9.1 Introduction......Page 353 9.2 Principle of Operation......Page 357 9.3 Mechanical Structure......Page 361 9.4 Electrical Interface and Signal Processing......Page 376 9.5 Design Trade-offs......Page 389 9.6 Future of Micromachined Gyroscopes......Page 390 9.7 References......Page 391 10.1 Introduction......Page 394 10.2 MEMS-Based Monitoring System for Space Applications......Page 395 10.3 Macro System-Level Architecture......Page 396 10.4 The Plug-and-Play COTS Approach......Page 413 10.5 Wireless Integrated Network Sensors......Page 416 10.6 Design of a Microinstrumentation Cluster......Page 417 10.7 Fabrication and Testing of the Mu Cluster......Page 438 10.8 Appendixes......Page 445 10.9 References......Page 449 11.1 Introduction......Page 454 11.2 Chemical Microsensor Technologies......Page 464 11.5 References......Page 487 12.2 Fabrication Technology......Page 490 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches......Page 492 12.4 Actuators......Page 495 12.5 Micromirrors for Adaptive Optics......Page 500 12.6 Micromirrors for Beam Steering......Page 504 12.8 Fresnel Lens......Page 510 12.9 Gratings......Page 511 12.10 Microoptical Bench and Automated Assembly of Microsystems......Page 517 12.12 References......Page 520 13.1 Introduction......Page 524 13.2 Future Communication System Design Requirements......Page 526 13.3 Micropackage Fabrication and Testing Method......Page 530 13.4 Micropackaged High-Isolation Interconnects......Page 537 13.5 Conformally Micropackaged LNA......Page 544 13.6 Discrete Micromachined Packages......Page 547 13.7 Micromachined Filters for High-Density Integration......Page 551 13.8 Conclusions......Page 555 13.9 References......Page 556 14.1 Introduction......Page 558 14.2 Shear Stress Imager......Page 562 14.3 Shear Stress Measurements and Fluid/Actuator Interaction......Page 569 14.4 Integration......Page 575 14.5 Control......Page 576 14.6 Electronics......Page 580 14.8 References......Page 583 15.1 Introduction......Page 586 15.2 To Distribute or not to Distribute?......Page 589 15.3 Issues and Problems......Page 610 15.4 Generalized Analysis......Page 626 15.5 Conclusions......Page 637 15.6 References......Page 639 16.3 Calculation of Theoretical Performance......Page 641 16.4 Calculation of Thrust......Page 642 16.5 Propellant Characteristics......Page 644 16.6 Special Propellant Considerations for Microthrusters......Page 645 16.7 Propellants: Cold-Gas Systems_11......Page 646 16.8 Monopropellants......Page 647 16.9 Bipropellants......Page 649 16.10 Solid Propellants......Page 651 16.11 Propellant Delivery and Combustion Concepts......Page 652 16.13 Appendixes......Page 655 16.14 References......Page 658 17.1 Introduction......Page 660 17.2 Micronozzles......Page 666 17.3 Fluid Actuators......Page 671 17.4 Laser-Based Processing of Glass/Ceramic Materials......Page 674 17.5 Microthruster Fabrication......Page 677 17.6 Microthruster Performance......Page 687 17.7 Micropropulsion via Bioenergetic Decay Processes......Page 690 17.10 References......Page 695 C......Page 700 D......Page 701 I......Page 702 M......Page 703 P......Page 706 S......Page 708 T......Page 709 Y......Page 710 Annotation Collects many of the ideas, fundamental principles, and technology rudiments that can profoundly change the manner by which aerospace systems are designed, engineered, and assembled. The concepts presented advance the use of microengineering principles to impart intelligence, volition, and motility to systems on the miniature scale, thereby effecting a change in the paradigm of how aerospace systems should be developed, maintained, and used. The 17 chapters cover the general areas of materials/mechanics/processing and packaging, microsystem devices, distributed system architectures, and satellite subsystems. The book is written in a tutorial style providing worked examples, key equations, and process sequences. Annotation c. Book News, Inc., Portland, OR (booknews.com) Annotation Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples Henry Helvajian, Editor. Includes Bibliographical References And Index.