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دانشجوعلاقه‌مند یادگیری
کتابخوان حرفه‌ایلذت مطالعه
نویسندهالهام‌گیری

Microengineering Aerospace Systems

Henry Helvajian, editor

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۴۴٬۰۰۰ تومان۴۹٬۰۰۰ تومان۱۰٪ تخفیف
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تحویل فوری
پرداخت امن
ضمانت فایل
پشتیبانی

مشخصات کتاب

سال انتشار
۱۹۹۹
فرمت
PDF
زبان
انگلیسی
حجم فایل
۳۱٫۷ مگابایت
شابک
9781601192172، 9781884989032، 1601192177، 1884989039

دربارهٔ کتاب

89039_fm 1 Front Matter 1 Acknowledgement 6 Preface 3 Table of Contents -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_toc 7 Front Matter -1 Preface -1 Table of Contents 7 1. Introduction to MEMS -1 1.1 Overview -1 1.2 Fabrication Technologies -1 1.3 MEMS Components -1 1.4 Commercial Applications -1 1.5 Trends in MEMS Technology -1 1.6 Journals and Conferences -1 1.7 References -1 2. Microengineering Space Systems -1 2.1 Introduction -1 2.2 Spacecraft Applications -1 2.3 Silicon Satellites -1 2.4 Manufacturing Future Space Systems -1 2.5 Conclusions -1 2.6 Acknowledgments -1 2.7 References -1 3. Mechanical Analysis and Properties of MEMS Materials -1 3.1 Introduction -1 3.2 Stress and Strain in MEMS -1 3.3 Constitutive Relations -1 3.4 Piezoelectricity -1 3.5 Failure Theories -1 3.6 Fracture Mechanics -1 3.7 Mechanical Properties of MEMS Structures -1 3.8 Fatigue -1 3.9 Microstructure of MEMS Materials -1 3.10 Other MEMS-Related Subjects -1 3.11 Examples -1 3.12 Future Challenges -1 3.13 References -1 4. MEMS for Harsh Application Environments -1 4.1 Overview -1 4.2 Material Properties of SiC -1 4.3 Thin Film Growth -1 4.4 Processing Techniques -1 4.5 Micromachining of SiC -1 4.6 SiC-on-Insulator Technologies -1 4.7 SiC Devices and Applications -1 4.8 Conclusions -1 4.9 References -1 5. Laser Processing for Microengineering Applications -1 5.1 Introduction -1 5.2 Laser Processing -1 5.3 Physical Principles of Laser Processing -1 5.4 Supporting Systems in Laser Processing -1 5.5 Utility and Limitations of Laser Processing -1 5.6 Microengineering Applications -1 5.7 A Case Study: Developing a PLD Materials-Processing Tool -1 5.8 Conclusions and Brief Overview of Trends -1 5.9 References -1 6. Rechargeable Li-ion Batteries for Satellite Applications: Pros and Cons -1 6.1 Introduction -1 6.2 Historical Development of Lithium Batteries -1 6.3 The Li-ion Battery -1 6.4 Plastic Li-ion Batteries -1 6.5 Conclusion -1 6.6 Acknowledgments -1 6.7 References -1 7. A Systems Approach to Microsystems Development -1 7.1 Introduction -1 7.2 Simulation Software -1 7.3 Microsystem Fabrication Technologies -1 7.4 Two Microsystem Investigation Examples at LAAS -1 7.5 Reliability -1 7.6 Conclusions -1 7.7 Acknowledgments -1 7.8 References -1 8. Space Electronics Packaging Research and Engineering -1 8.1 Introduction -1 8.2 Basic Concepts -1 8.3 Engineering Considerations for Packaging -1 8.4 Advanced Approaches -1 8.5 Conclusions -1 8.6 References -1 9. Micromachined Rate Gyroscopes -1 9.1 Introduction -1 9.2 Principle of Operation -1 9.3 Mechanical Structure -1 9.4 Electrical Interface and Signal Processing -1 9.5 Design Trade-offs -1 9.6 Future of Micromachined Gyroscopes -1 9.7 References -1 10. MEMS-Based Sensing Systems: Architecture, Design, and Implementation -1 10.1 Introduction -1 10.2 MEMS-Based Monitoring System for Space Applications -1 10.3 Macro System-Level Architecture -1 10.4 The Plug-and-Play COTS Approach -1 10.5 Wireless Integrated Network Sensors -1 10.6 Design of a Microinstrumentation Cluster -1 10.7 Fabrication and Testing of the Mu Cluster -1 10.8 Appendixes -1 10.9 References -1 11. Chemical Microsensors for Gas Detection and Applications to Space Systems -1 11.1 Introduction -1 11.2 Chemical Microsensor Technologies -1 11.3 Conclusions -1 11.4 Acknowledgments -1 11.5 References -1 12. Surface Micromachined Optical Systems -1 12.1 Introduction -1 12.2 Fabrication Technology -1 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches -1 12.4 Actuators -1 12.5 Micromirrors for Adaptive Optics -1 12.6 Micromirrors for Beam Steering -1 12.7 Corner-Cube Reflector -1 12.8 Fresnel Lens -1 12.9 Gratings -1 12.10 Microoptical Bench and Automated Assembly of Microsystems -1 12.11 Summary -1 12.12 References -1 13. Micropackaging High-Density Radio-Frequency Microwave Circuits -1 13.1 Introduction -1 13.2 Future Communication System Design Requirements -1 13.3 Micropackage Fabrication and Testing Method -1 13.4 Micropackaged High-Isolation Interconnects -1 13.5 Conformally Micropackaged LNA -1 13.6 Discrete Micromachined Packages -1 13.7 Micromachined Filters for High-Density Integration -1 13.8 Conclusions -1 13.9 References -1 14. MEMS-Based Active Drag Reduction in Turbulent Boundary Layers -1 14.1 Introduction -1 14.2 Shear Stress Imager -1 14.3 Shear Stress Measurements and Fluid/Actuator Interaction -1 14.4 Integration -1 14.5 Control -1 14.6 Electronics -1 14.7 Conclusions -1 14.8 References -1 15. Analysis Tools and Architecture Issues for Distributed Satellite Systems -1 15.1 Introduction -1 15.2 To Distribute or not to Distribute? -1 15.3 Issues and Problems -1 15.4 Generalized Analysis -1 15.5 Conclusions -1 15.6 References -1 16. Propellants for Microspacecraft -1 16.1 Introduction -1 16.2 Propellant Fundamentals_1-3 -1 16.3 Calculation of Theoretical Performance -1 16.4 Calculation of Thrust -1 16.5 Propellant Characteristics -1 16.6 Special Propellant Considerations for Microthrusters -1 16.7 Propellants: Cold-Gas Systems_11 -1 16.8 Monopropellants -1 16.9 Bipropellants -1 16.10 Solid Propellants -1 16.11 Propellant Delivery and Combustion Concepts -1 16.12 Acknowledgments -1 16.13 Appendixes -1 16.14 References -1 17. Micropropulsion Systems for Aircratt and Spacecraft -1 17.1 Introduction -1 17.2 Micronozzles -1 17.3 Fluid Actuators -1 17.4 Laser-Based Processing of Glass/Ceramic Materials -1 17.5 Microthruster Fabrication -1 17.6 Microthruster Performance -1 17.7 Micropropulsion via Bioenergetic Decay Processes -1 17.8 Conclusions -1 17.9 Acknowledgments -1 17.10 References -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_01 8 Front Matter -1 Table of Contents -1 1. Introduction to MEMS 8 1.1 Overview 8 1.2 Fabrication Technologies 12 1.3 MEMS Components 23 1.4 Commercial Applications 30 1.5 Trends in MEMS Technology 32 1.6 Journals and Conferences 33 1.7 References 34 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_02 36 Front Matter -1 Table of Contents -1 2. Microengineering Space Systems 36 2.1 Introduction 36 2.2 Spacecraft Applications 50 2.3 Silicon Satellites 64 2.4 Manufacturing Future Space Systems 67 2.5 Conclusions 71 2.6 Acknowledgments 72 2.7 References 72 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_03 80 Front Matter -1 Table of Contents -1 3. Mechanical Analysis and Properties of MEMS Materials 80 3.1 Introduction 80 3.2 Stress and Strain in MEMS 82 3.3 Constitutive Relations 85 3.4 Piezoelectricity 93 3.5 Failure Theories 94 3.6 Fracture Mechanics 96 3.7 Mechanical Properties of MEMS Structures 100 3.8 Fatigue 107 3.9 Microstructure of MEMS Materials 112 3.10 Other MEMS-Related Subjects 114 3.11 Examples 115 3.12 Future Challenges 119 3.13 References 121 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_04 125 Front Matter -1 Table of Contents -1 4. MEMS for Harsh Application Environments 125 4.1 Overview 125 4.2 Material Properties of SiC 125 4.3 Thin Film Growth 126 4.4 Processing Techniques 129 4.5 Micromachining of SiC 131 4.6 SiC-on-Insulator Technologies 137 4.7 SiC Devices and Applications 141 4.8 Conclusions 146 4.9 References 146 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_05 151 Front Matter -1 Table of Contents -1 5. Laser Processing for Microengineering Applications 151 5.1 Introduction 151 5.2 Laser Processing 153 5.3 Physical Principles of Laser Processing 157 5.4 Supporting Systems in Laser Processing 166 5.5 Utility and Limitations of Laser Processing 170 5.6 Microengineering Applications 172 5.7 A Case Study: Developing a PLD Materials-Processing Tool 185 5.8 Conclusions and Brief Overview of Trends 200 5.9 References 201 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_06 206 Front Matter -1 Table of Contents -1 6. Rechargeable Li-ion Batteries for Satellite Applications: Pros and Cons 206 6.1 Introduction 206 6.2 Historical Development of Lithium Batteries 207 6.3 The Li-ion Battery 210 6.4 Plastic Li-ion Batteries 222 6.5 Conclusion 228 6.6 Acknowledgments 229 6.7 References 229 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_07 232 Front Matter -1 Table of Contents -1 7. A Systems Approach to Microsystems Development 232 7.1 Introduction 232 7.2 Simulation Software 233 7.3 Microsystem Fabrication Technologies 238 7.4 Two Microsystem Investigation Examples at LAAS 244 7.5 Reliability 256 7.6 Conclusions 261 7.7 Acknowledgments 262 7.8 References 262 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_08a 264 Front Matter -1 Table of Contents -1 8. Space Electronics Packaging Research and Engineering 264 8.1 Introduction 264 8.2 Basic Concepts 264 8.3 Engineering Considerations for Packaging 288 8.4 Advanced Approaches -1 8.5 Conclusions -1 8.6 References -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_08b 319 Front Matter -1 Table of Contents -1 8. Space Electronics Packaging Research and Engineering -1 8.1 Introduction -1 8.2 Basic Concepts -1 8.3 Engineering Considerations for Packaging -1 8.4 Advanced Approaches 319 8.5 Conclusions 347 8.6 References 348 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_09 352 Front Matter -1 Table of Contents -1 9. Micromachined Rate Gyroscopes 352 9.1 Introduction 352 9.2 Principle of Operation 356 9.3 Mechanical Structure 360 9.4 Electrical Interface and Signal Processing 375 9.5 Design Trade-offs 388 9.6 Future of Micromachined Gyroscopes 389 9.7 References 390 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_10 393 Front Matter -1 Table of Contents -1 10. MEMS-Based Sensing Systems: Architecture, Design, and Implementation 393 10.1 Introduction 393 10.2 MEMS-Based Monitoring System for Space Applications 394 10.3 Macro System-Level Architecture 395 10.4 The Plug-and-Play COTS Approach 412 10.5 Wireless Integrated Network Sensors 415 10.6 Design of a Microinstrumentation Cluster 416 10.7 Fabrication and Testing of the Mu Cluster 437 10.8 Appendixes 444 10.9 References 448 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_11 453 Front Matter -1 Table of Contents -1 11. Chemical Microsensors for Gas Detection and Applications to Space Systems 453 11.1 Introduction 453 11.2 Chemical Microsensor Technologies 463 11.3 Conclusions 486 11.4 Acknowledgments 486 11.5 References 486 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_12a 489 Front Matter -1 Table of Contents -1 12. Surface Micromachined Optical Systems 489 12.1 Introduction 489 12.2 Fabrication Technology 489 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches 491 12.4 Actuators 494 12.5 Micromirrors for Adaptive Optics 499 12.6 Micromirrors for Beam Steering 503 12.7 Corner-Cube Reflector -1 12.8 Fresnel Lens -1 12.9 Gratings -1 12.10 Microoptical Bench and Automated Assembly of Microsystems -1 12.11 Summary -1 12.12 References -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_12b 509 Front Matter -1 Table of Contents -1 12. Surface Micromachined Optical Systems -1 12.1 Introduction -1 12.2 Fabrication Technology -1 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches -1 12.4 Actuators -1 12.5 Micromirrors for Adaptive Optics -1 12.6 Micromirrors for Beam Steering -1 12.7 Corner-Cube Reflector 509 12.8 Fresnel Lens 509 12.9 Gratings 510 12.10 Microoptical Bench and Automated Assembly of Microsystems 516 12.11 Summary 519 12.12 References 519 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_13 523 Front Matter -1 Table of Contents -1 13. Micropackaging High-Density Radio-Frequency Microwave Circuits 523 13.1 Introduction 523 13.2 Future Communication System Design Requirements 525 13.3 Micropackage Fabrication and Testing Method 529 13.4 Micropackaged High-Isolation Interconnects 536 13.5 Conformally Micropackaged LNA 543 13.6 Discrete Micromachined Packages 546 13.7 Micromachined Filters for High-Density Integration 550 13.8 Conclusions 554 13.9 References 555 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_14 557 Front Matter -1 Table of Contents -1 14. MEMS-Based Active Drag Reduction in Turbulent Boundary Layers 557 14.1 Introduction 557 14.2 Shear Stress Imager 561 14.3 Shear Stress Measurements and Fluid/Actuator Interaction 568 14.4 Integration 574 14.5 Control 575 14.6 Electronics 579 14.7 Conclusions 582 14.8 References 582 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_15 585 Front Matter -1 Table of Contents -1 15. Analysis Tools and Architecture Issues for Distributed Satellite Systems 585 15.1 Introduction 585 15.2 To Distribute or not to Distribute? 588 15.3 Issues and Problems 609 15.4 Generalized Analysis 625 15.5 Conclusions 636 15.6 References 638 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_16 640 Front Matter -1 Table of Contents -1 16. Propellants for Microspacecraft 640 16.1 Introduction 640 16.2 Propellant Fundamentals_1-3 640 16.3 Calculation of Theoretical Performance 640 16.4 Calculation of Thrust 641 16.5 Propellant Characteristics 643 16.6 Special Propellant Considerations for Microthrusters 644 16.7 Propellants: Cold-Gas Systems_11 645 16.8 Monopropellants 646 16.9 Bipropellants 648 16.10 Solid Propellants 650 16.11 Propellant Delivery and Combustion Concepts 651 16.12 Acknowledgments 654 16.13 Appendixes 654 16.14 References 657 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_17 659 Front Matter -1 Table of Contents -1 17. Micropropulsion Systems for Aircratt and Spacecraft 659 17.1 Introduction 659 17.2 Micronozzles 665 17.3 Fluid Actuators 670 17.4 Laser-Based Processing of Glass/Ceramic Materials 673 17.5 Microthruster Fabrication 676 17.6 Microthruster Performance 686 17.7 Micropropulsion via Bioenergetic Decay Processes 689 17.8 Conclusions 694 17.9 Acknowledgments 694 17.10 References 694 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 Y -1 89039_indx 699 Front Matter -1 Table of Contents -1 Index 699 A 699 B 699 C 699 D 700 E 701 F 701 G 701 H 701 I 701 K 702 L 702 M 702 N 705 O 705 P 705 Q 707 R 707 S 707 T 708 U 709 V 709 W 709 Y 709 Front Matter......Page 1 Acknowledgement......Page 6 Preface......Page 3 Table of Contents......Page 0 Table of Contents......Page 7 1.1 Overview......Page 8 1.2 Fabrication Technologies......Page 12 1.3 MEMS Components......Page 23 1.4 Commercial Applications......Page 30 1.5 Trends in MEMS Technology......Page 32 1.6 Journals and Conferences......Page 33 1.7 References......Page 34 2.1 Introduction......Page 36 2.2 Spacecraft Applications......Page 50 2.3 Silicon Satellites......Page 64 2.4 Manufacturing Future Space Systems......Page 67 2.5 Conclusions......Page 71 2.7 References......Page 72 3.1 Introduction......Page 80 3.2 Stress and Strain in MEMS......Page 82 3.3 Constitutive Relations......Page 85 3.4 Piezoelectricity......Page 93 3.5 Failure Theories......Page 94 3.6 Fracture Mechanics......Page 96 3.7 Mechanical Properties of MEMS Structures......Page 100 3.8 Fatigue......Page 107 3.9 Microstructure of MEMS Materials......Page 112 3.10 Other MEMS-Related Subjects......Page 114 3.11 Examples......Page 115 3.12 Future Challenges......Page 119 3.13 References......Page 121 4.2 Material Properties of SiC......Page 125 4.3 Thin Film Growth......Page 126 4.4 Processing Techniques......Page 129 4.5 Micromachining of SiC......Page 131 4.6 SiC-on-Insulator Technologies......Page 137 4.7 SiC Devices and Applications......Page 141 4.9 References......Page 146 5.1 Introduction......Page 151 5.2 Laser Processing......Page 153 5.3 Physical Principles of Laser Processing......Page 157 5.4 Supporting Systems in Laser Processing......Page 166 5.5 Utility and Limitations of Laser Processing......Page 170 5.6 Microengineering Applications......Page 172 5.7 A Case Study: Developing a PLD Materials-Processing Tool......Page 185 5.8 Conclusions and Brief Overview of Trends......Page 200 5.9 References......Page 201 6.1 Introduction......Page 206 6.2 Historical Development of Lithium Batteries......Page 207 6.3 The Li-ion Battery......Page 210 6.4 Plastic Li-ion Batteries......Page 222 6.5 Conclusion......Page 228 6.7 References......Page 229 7.1 Introduction......Page 232 7.2 Simulation Software......Page 233 7.3 Microsystem Fabrication Technologies......Page 238 7.4 Two Microsystem Investigation Examples at LAAS......Page 244 7.5 Reliability......Page 256 7.6 Conclusions......Page 261 7.8 References......Page 262 8.2 Basic Concepts......Page 264 8.3 Engineering Considerations for Packaging......Page 288 8.4 Advanced Approaches......Page 319 8.5 Conclusions......Page 347 8.6 References......Page 348 9.1 Introduction......Page 352 9.2 Principle of Operation......Page 356 9.3 Mechanical Structure......Page 360 9.4 Electrical Interface and Signal Processing......Page 375 9.5 Design Trade-offs......Page 388 9.6 Future of Micromachined Gyroscopes......Page 389 9.7 References......Page 390 10.1 Introduction......Page 393 10.2 MEMS-Based Monitoring System for Space Applications......Page 394 10.3 Macro System-Level Architecture......Page 395 10.4 The Plug-and-Play COTS Approach......Page 412 10.5 Wireless Integrated Network Sensors......Page 415 10.6 Design of a Microinstrumentation Cluster......Page 416 10.7 Fabrication and Testing of the Mu Cluster......Page 437 10.8 Appendixes......Page 444 10.9 References......Page 448 11.1 Introduction......Page 453 11.2 Chemical Microsensor Technologies......Page 463 11.5 References......Page 486 12.2 Fabrication Technology......Page 489 12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches......Page 491 12.4 Actuators......Page 494 12.5 Micromirrors for Adaptive Optics......Page 499 12.6 Micromirrors for Beam Steering......Page 503 12.8 Fresnel Lens......Page 509 12.9 Gratings......Page 510 12.10 Microoptical Bench and Automated Assembly of Microsystems......Page 516 12.12 References......Page 519 13.1 Introduction......Page 523 13.2 Future Communication System Design Requirements......Page 525 13.3 Micropackage Fabrication and Testing Method......Page 529 13.4 Micropackaged High-Isolation Interconnects......Page 536 13.5 Conformally Micropackaged LNA......Page 543 13.6 Discrete Micromachined Packages......Page 546 13.7 Micromachined Filters for High-Density Integration......Page 550 13.8 Conclusions......Page 554 13.9 References......Page 555 14.1 Introduction......Page 557 14.2 Shear Stress Imager......Page 561 14.3 Shear Stress Measurements and Fluid/Actuator Interaction......Page 568 14.4 Integration......Page 574 14.5 Control......Page 575 14.6 Electronics......Page 579 14.8 References......Page 582 15.1 Introduction......Page 585 15.2 To Distribute or not to Distribute?......Page 588 15.3 Issues and Problems......Page 609 15.4 Generalized Analysis......Page 625 15.5 Conclusions......Page 636 15.6 References......Page 638 16.3 Calculation of Theoretical Performance......Page 640 16.4 Calculation of Thrust......Page 641 16.5 Propellant Characteristics......Page 643 16.6 Special Propellant Considerations for Microthrusters......Page 644 16.7 Propellants: Cold-Gas Systems_11......Page 645 16.8 Monopropellants......Page 646 16.9 Bipropellants......Page 648 16.10 Solid Propellants......Page 650 16.11 Propellant Delivery and Combustion Concepts......Page 651 16.13 Appendixes......Page 654 16.14 References......Page 657 17.1 Introduction......Page 659 17.2 Micronozzles......Page 665 17.3 Fluid Actuators......Page 670 17.4 Laser-Based Processing of Glass/Ceramic Materials......Page 673 17.5 Microthruster Fabrication......Page 676 17.6 Microthruster Performance......Page 686 17.7 Micropropulsion via Bioenergetic Decay Processes......Page 689 17.10 References......Page 694 C......Page 699 D......Page 700 I......Page 701 M......Page 702 P......Page 705 S......Page 707 T......Page 708 Y......Page 709 Annotation Collects many of the ideas, fundamental principles, and technology rudiments that can profoundly change the manner by which aerospace systems are designed, engineered, and assembled. The concepts presented advance the use of microengineering principles to impart intelligence, volition, and motility to systems on the miniature scale, thereby effecting a change in the paradigm of how aerospace systems should be developed, maintained, and used. The 17 chapters cover the general areas of materials/mechanics/processing and packaging, microsystem devices, distributed system architectures, and satellite subsystems. The book is written in a tutorial style providing worked examples, key equations, and process sequences. Annotation c. Book News, Inc., Portland, OR (booknews.com) Annotation Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples

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